当前位置:首页 >> 材料科学 >>

60um UFP SSB Bonding


Kulicke & Soffa (Suzhou) Limited.

1. Introduction & Background
Spansion (Suzhou) has a UFP (60, 50 and 45?m BPP) SSB process development roadmap to be completed by FY2005. As part of continuous technology collaboration between Spansion package development and K&S Engineering, Spansion SZ request K&S SZ Engineering to jointly work on this UFP project. 60?m BPP process development will be attempted first. This report summarizes the 60?m BPP SSB process development on Maxumplus ball bonder.

2. Objective & Deliverable
Establish a set of parameter in meeting customer specification of bonding 60?m BPP with 52um BPO using SSB2 loop profile on MaxumPlus.

3. Materials and Equipment
Bonded Ball Bonder Software Version Bond Tester Microscope Bond Temperature Capillary 1 Capillary 2 Wire Type (EL%, BL %) Maxumplus 9-28-2-32B Dage 4000 Nikon 180 C 414FE-2025-R33 (H12 CD15 T033 OR05 F11) 414FF-2093-R33 (H12 CD14T030 OR05 F11) AW99; 1.0 mil (EL 2~7%; BL 9~14g)

Package & Device Information:

Package Type (PBGA/QFP/CSP) Row by Column per Index Indexes per strip Substrate/L/F thickness (mils) Die thickness (mils) Min / Max wire length (mils) Min in-line bond pad pitch (?m) ?

FBGA 5R X 3C 4 8 11 140 max; 160 max 60?m (K&S test die)

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 1 of 13

Kulicke & Soffa (Suzhou) Limited.
Bond pad size / opening (?m) ?

52 (K&S test die)

Customer’s specification (reverse bonding): Bonding Responses Bump Ball Diameter (?m) Bump Ball Height (?m) Loop Height (SSB) (?m) Bump Ball Shear (gram) Wire Pull (gram) Shear Strength (gram/mils ) Bonding temperature ( C)
? 2

Specification Range Min 46.0 8.0 100.0 >5.7 > 3.0 PRE 180 Max 50.0 13.0 175.0 — — >5.5 SITE 180 POST 180 Avg 48.0 10.5 125.0 — — Cpk — — — — —

4. Set-up Conditions and Procedures
? Machine preparation. ? Bonding process optimization. ? Data measurement and analysis. ? Compilation of application report.

5. Results and Discussion
Bonding response data (collected on K&S test die) Bonding Responses Bump Ball Diameter (?m) Bump Ball Height (?m) Loop Height (SSB) (?m) Bump Ball Shear (gram) Wire Pull (gram) Shear Strength (gram/mils ) ? Ball shear strength is low due to the contaminated test wafer. ? Other bonding response data meet specs, refer to Appendix I for details. ? No bonding stoppages observed over continuous bonding of 2 strips (120 units).
2

Results Min 48.39 12.19 123.7 14.08 6.97 Max 49.66 13.72 154.2 16.78 9.22 Avg 48.93 12.88 132.3 15.22 8.03 5.22 Stdev 0.42 0.48 7.4 0.75 0.53 Cpk — — — 4.24 3.15

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 2 of 13

Kulicke & Soffa (Suzhou) Limited.

Bump and SSB optimization ? Initial capillary p/n: 414FE-2025-R33 (H12 CD15 T033 OR05 F11) Spansion SZ have completed 2 bond DOE and 1 bond DOE using the standard capillary prior to bump and SSB process optimization and process window was confirmed. Bump DOE was done for Accu-bump and Flex-bump. Good bump shape was achieved. Refer to Appendix III for the SEM photos of Accu-bump & Flex-bump. SSB test: 1) With high Cap-Bond-Offset (CBO) setting, frequent NSOL occurred. This may caused by poor wire tail deformation due to insufficient landing area. 2) By decreasing the CBO to -0.75mils, NSOL was eliminated, but bump was severely flattened out due to capillary tip press with high SSB force upon the bump. Refer to below SEM photos.
nd st

3) Tail-Scrub function was applied to SSB bonding and reduced the SSB force/USG and increased the CBO to -1.0 mils. Better bump shape was maintained and no NSOL occurred. Refer to below SEM photos.

Result: Tail scrub function show significant help to resolve bump flatten issue.
K&S Confidential K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212 Page 3 of 13

Kulicke & Soffa (Suzhou) Limited.
Capillary with smaller tip size may be effective on improving bump shape after SSB bonding.

? New design capillary p/n: 414FF-2093-R33 (H12 CD14 T030 OR05 F11) Based on the result of initial capillary and considering the requirement of forward bonding, a new capillary with tip 3.0mils was selected. Re-optimization on forward bonding 2nd bond & 1st bond DOE was done prior to SSB test to verify the capability of forward bonding. The DOE was performed on customer product due to contaminated test dies. The DOE is based on JUMP software at customer site. 1) 2nd Bond DOE DOE matrix and best setting:

Process window:

C/V USG Current Bond Force

Parameter Window 0.4 75~95 50~66

Desirable setting 0.4 84 58

2) 1st Bond DOE -- Done on customer die which the BPP is more than 60um. DOE matrix and best setting

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 4 of 13

Kulicke & Soffa (Suzhou) Limited.

Process window:

C/V USG Current Bond Force

Parameter Window 0.2 70~78 12~15

Desirable setting 0.2 73 13

3) Confirmation run (data collected on customer die)
Bonding Responses Loop Height (um) Ball Thickness (um) Ball Size (um) Ball Shear (gram) Wire Pull (gram) Shear/UA Min 107.95 11.68 45.21 18.03 10.95 Results Max Avg 125.22 117.11 13.46 12.52 47.75 46.51 22.37 19.38 13.27 12.35 7.36 gram/mil^2 Stdev 6.15 0.47 0.68 1.13 0.64 Cpk — — — 4.05 4.86

2nd bond & 1st bond forward bonding process window was confirmed and all bonding response data meet specs. Refer to Appendix II – Responses data of DOE confirmation run (forward). SSB test: 1) NSOL still encountered if high CBO was set and turned off the tail scrub function. 2) Bump shape was significantly improved when tail scrub function was applied and CBO was set to around -1.00. Refer to below SEM photos for the bump shape Vs CBO settings.

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 5 of 13

Kulicke & Soffa (Suzhou) Limited.

CBO= -1.05

CBO= -1.00

CBO= -0.90

CBO= -0.80

Result: 1) The new capillary with 3.0mils tip size is capable of forward bonding. 2) Good bump shape was also achieved by the new capillary coupled with tail scrub function and proper CBO setting. 3) No bonding stoppages occurred over continuous bonding of 2 strips (120 units) SSB-2 looping optimization Wire length 140mils max. No wire sway was observed after wire bonding. Wire-to-die edge clearance was more than 2.5mils. Refer to Appendix IV. Wire length 160mils max. Slight wire sway was observed after wire bonding. Wire-to-die edge clearance was more than 2.5mils. Refer to Appendix V.

6. Conclusions and Recommendations
? Reverse bonding process for 60um BPP UFP with different wire length from 120mil to 160mil is successfully established on K&S Maxumplus platform. ? Need re-optimization on bump parameters with actual device to meet the spec of min shear strength >5.5 gram/mil^2. ? Molding test is ongoing to check wire length capability, it is very dependent on molding which has a number of factors – wire angle, wire position, type of molding, etc. ? Baking test on actual device is needed in future to check 1 bond reliability.
st

? All the studies are based on K&S test die (only 1 bond DOE was done on customer die) with small qty (2strips/run), might need actual device with larger quantity for further confirmation.
st

? It would be more realistic and simpler if we can know bonding requirements from actual packaging, such as package, device, stacking, etc.
K&S Confidential K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212 Page 6 of 13

Kulicke & Soffa (Suzhou) Limited.
7. Appendix
? Appendix I – Response Data (reverse) ? Appendix II – Responses data of DOE confirmation run (forward) ? Appendix III – SEM photos of Accu-bump & Flex-bump ? Appendix IV – SEM photos of wire length 140mils max ? Appendix V – SEM photos of wire length 160mils max ? Appendix VI – Parameter Log

Appendix I - Response Data (reverse)
Data collected on K&S test die.
Sample# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Loop Height (um) 128.78 127.25 127.51 123.95 125.98 124.97 129.79 128.52 125.73 127.51 124.97 123.70 132.84 131.06 136.40 126.24 131.57 128.78 130.81 130.56 133.60 135.38 135.89 137.67 139.70 Wire Pull (grams) 8.46 7.83 8.64 7.37 7.86 7.39 7.88 8.01 8.29 8.48 7.67 8.29 8.06 7.91 8.93 8.77 9.22 8.46 7.82 6.97 7.71 7.28 8.14 7.69 8.49 Ball Shear (grams) 14.29 14.08 16.05 14.89 15.49 14.25 14.87 14.88 14.38 14.39 14.61 16.11 16.12 14.82 15.64 14.89 14.81 15.94 15.13 14.86 14.97 16.78 14.92 14.77 15.92 Ball Size (um) 48.90 49.40 48.64 48.39 48.90 48.77 49.66 49.28 49.02 48.39 Ball Thickness (um) 12.70 13.21 12.95 13.46 12.45 13.72 12.70 12.19 12.95 12.45

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 7 of 13

Kulicke & Soffa (Suzhou) Limited.
26 27 28 29 30 Max Min Avg SD Cpk Shear/UA 138.18 137.67 136.40 152.91 154.18 154.18 123.70 132.28 7.44 7.09 8.29 7.73 7.91 8.21 9.22 6.97 8.03 0.53 3.15 16.45 14.54 16.35 15.27 16.13 16.78 14.08 15.22 0.75 4.24 5.22 gram/mil^2 49.66 48.39 48.93 0.42 13.72 12.19 12.88 0.48







Appendix II – Responses data of DOE confirmation run (forward)
Data collected on customer die.
Sample # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Max Min Avg SD Cpk Loop Height (um) 108.71 109.73 108.71 111.25 112.01 110.24 107.95 121.92 122.43 119.13 121.41 123.95 121.67 112.27 122.43 119.89 118.36 120.65 124.21 125.22 125.22 107.95 117.11 6.15 Ball Shear (gram) 18.50 19.41 18.03 18.51 18.18 19.31 18.63 19.29 18.21 19.68 18.98 20.35 18.95 18.99 18.99 21.12 18.95 22.37 21.14 20.07 22.37 18.03 19.38 1.13 4.05 Wire Pull (gram) 12.44 12.77 12.95 12.73 12.78 12.82 12.63 13.27 12.01 13.12 12.90 12.39 11.68 12.22 12.52 11.50 11.18 10.95 11.93 12.15 13.27 10.95 12.35 0.64 4.86 Ball Thickness (um) 11.68 12.70 11.94 12.19 12.45 12.19 12.70 12.45 11.94 12.45 12.70 12.70 12.19 12.70 12.19 12.95 12.95 13.46 13.46 12.45 13.46 11.68 12.52 0.47 Ball Size X (um) 46.99 48.01 48.01 46.48 46.48 47.50 45.97 46.99 45.97 45.72 47.24 47.50 45.47 47.50 46.99 46.48 46.23 48.01 46.48 45.72 48.01 45.47 46.79 0.81 Ball Size Y (um) 47.24 47.50 47.50 45.97 46.23 46.23 45.72 46.48 45.97 45.97 44.96 45.97 44.96 46.99 47.50 45.97 45.72 45.72 45.97 45.97 47.50 44.96 46.23 0.76 Ball Size (um) 47.12 47.75 47.75 46.23 46.36 46.86 45.85 46.74 45.97 45.85 46.10 46.74 45.21 47.24 47.24 46.23 45.97 46.86 46.23 45.85 47.75 45.21 46.51 0.68

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 8 of 13

Kulicke & Soffa (Suzhou) Limited.
Shear/UA 7.36 gram/mil^2

Appendix III – SEM photos of Accu-bump and Flex-bump Accu-Bump

Flex-Bump

Appendix IV – SEM photos of wire length 140mils max.
1) Bumping with SSB2 loop profile -- good bump shape

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 9 of 13

Kulicke & Soffa (Suzhou) Limited.

2) SSB2 loop profile -- Consistent loop height and no wire sway after bonding

3) Adequate wire-to-die edge clearance -- More than 2.5mils

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 10 of 13

Kulicke & Soffa (Suzhou) Limited.

4) Loop ball on lead and neck condition

Appendix V – SEM photos of wire length 160mils max.

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 11 of 13

Kulicke & Soffa (Suzhou) Limited.
Consistent loop height Slight wire sway observed

Adequate wire-to-die edge clearance -- More than 2.5mils

Appendix VI - Parameter Log
K&S Confidential K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212 Page 12 of 13

Kulicke & Soffa (Suzhou) Limited.
1st Bond Parameter Tip (mils) CV (mils/ms) USG Mode USG Current USG Bond Time (ms) Force (gm) Init'l USG Time ( % ) Init'l USG Level ( % ) Power Equ Factor (%) USG Pre Bleed ( % ) USG Profile Contact Detect Mode Ramp-up Time (%) Ramp-Dn Time (%) Contact Threshold (%) Force Profiling Seating USG Bleed Current 1 Bump Tip ( mil ) Bump C/V ( mils/ms ) Bump USG Current Bump Bond Time ( ms ) Bump Bond Force ( gm ) Bond Contact Mode Bump USG Pre Delay Bump Pre Bleed Bump Lift Throttle Lift USG Ratio Lift Throttle ALL 8 0.4 CC 110 15 30 0 100 105 10 Ramp P mode 0 10 50 Off 80 10 8 0.18 68-76 30 12-15 V mode 3 50 40 5 70 2nd-Bond Parameter Tip (mils) CV (mils/ms) USG Mode USG Current USG Bond Time (ms) Force (gm) Init'l USG Time ( % ) Init'l USG Level ( % ) SSB USG Current SSB Bond Time ( ms ) SSB Bond Force ( gm ) Power Equ Factor (%) Force Equ Factor (%) Z - Teat State Z_Tear USG (mA) Z_Tear Speed (%) USG Profile Contact Threshold (%) Force Profiling Cap Bond Offset ( mil ) Bleed Current Tail Scrub XY (um) Tail Scrub Phase Tail Scrub Mode Tail Scrub Cycle Tail Scrub Freq. Tail Scrub Offset (um) Tail Scrub Force (gm) Tail Scrub USG (%) ALL 8 0.25 CC 80 15 55 0 100 10-20 10 10-20 100 100 On 150 20 Square 50 Off -0.95 10 3 Inline Contact 1 150 -3 25 0 Loop Parameter Kink Height Rev Motion Loop Factor Approach Method LF4 Rmot Angle Rev Motion 2 Rmot Angle 2 LF2 Loop Balance Ref Wire Length (mils) Balance Mode X Balance Y Balance Bleed Voltage Span Distance Shape Factor 1 Span Length 1 Smoothness1 Shape Factor 2 Span Length 2 SF2 Smoothness Last Kink Length (mils) Last Kink Angle (deg) Last Kink Factor (%) Kink Loop Factor (mils) Kink Balance Kink Bleed Voltage Bump Mode Bump Height Seperation Height Smooth Distance Smooth Speed Smooth USG First Speed (%) Reverse Speed (%) Loop Speed (%) Tail Speed (%) Reset Speed (%) 140mils max. WL 4.0 4.0 -4.5 Standard 70 80 4.0 105 -20 95 122 Standard 100 100 1000 Percentage 28 28 100 15 50 50 5 70 65 -4 95 0 Accu 0.45 0.90 -1.05 50 20 100 60 70 60 60 160mils max. WL 4.0 4.0 -2.8 Standard 60 70 4.0 95 -15 98.5 0 Standard 100 100 1000 Percentage 28 28 100 12 50 30 4 66 62 -2 99.2 0 Accu 0.45 0.90 -1.05 50 20 80 60 60 50 60

Ball Size Parameter Wire Size ( mil ) FAB Size ( mil ) EFO Current ( mA ) EFO Gap ( mil ) Tail Extension ( mil ) EFO Fire Control Loop FAB Size

ALL 1.0 1.58 35 30 10 Standard 1.90

K&S Confidential

K&S Suzhou Process Engineering Center No.255 Suhong Middle Road, Suzhou Industrial Park, China 251021 Tel: (86) 51262588588 ? Fax: (86) 51262580212

Page 13 of 13


相关文章:
C Process menu.pdf
60um UFP SSB Bonding 13页 免费 SPT 劈刀设计 28页
Developments in Copper Wire Bonding.pdf
Developments in Copper Wire Bonding_金融/投资_经管营销_专业资料。Developments ...35um Staggered Bond 65um 55um 50um 45um SSB Bond 50um 45um Wire ...
ATM-0087中文资料.pdf
Flip Chip Study 56页 免费 60um UFP SSB Bonding 13页 免费如要投诉违规内容,请到百度文库投诉中心;如要提出功能问题或意见建议,请点击此处进行反馈。 ...
更多相关标签: