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TXB0104


元器件交易网www.cecb2b.com TXB0104
www.ti.com.............................................................................................................................................................. SCES650D – APRIL 2006 – REVISED MAY 2008

4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION SENSING AND ±15-kV ESD PROTECTION
1

FEATURES
? ESD Protection Exceeds JESD 22 – A Port – 2500-V Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) – B Port – ±15-kV Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101)

? 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB) ? VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State ? OE Input Circuit Referenced to VCCA ? Low Power Consumption, 5-?A Max ICC ? Ioff Supports Partial-Power-Down Mode Operation ? Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
2

GXU/ZXU PACKAGE (TOP VIEW) A 4 3 2 1 B C

TERMINAL ASSIGNMENTS (GXU/ZXU Package)
A 4 3 2 1 A4 A3 A2 A1 B GND OE VCCA VCCB C B4 B3 B2 B1

RGY PACKAGE (TOP VIEW)

VCCA

VCCA A1 A2 A3 A4 NC GND

1 2 3 4 5 6 7

14 13 12 11 10 9 8

VCCB B1 B2 B3 B4 NC OE A1 A2 A3 A4 NC
2 3 4 5 6

1

VCCB
14 13 B1 12 B2 11 B3 10 B4 9 NC 8

D OR PW PACKAGE (TOP VIEW)

Exposed Center Pad

7

GND

N.C. ? No internal connection For RGY, if the exposed center pad is used it must only be connected to as a secondary ground or left electrically open.

1

2

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments.
Copyright ? 2006–2008, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

OE

元器件交易网www.cecb2b.com TXB0104
SCES650D – APRIL 2006 – REVISED MAY 2008.............................................................................................................................................................. www.ti.com

YZT PACKAGE (TOP VIEW) 3 2 1 D C B A
D C B A

TERMINAL ASSIGNMENTS (YZT Package)
3 A4 A3 A2 A1 2 GND OE VCCA VCCB 1 B4 B3 B2 B1

DESCRIPTION/ORDERING INFORMATION
This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The TXB0104 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION
TA PACKAGE
(1) (2)

ORDERABLE PART NUMBER Reel of 3000 Reel of 2500 Reel of 2500 Reel of 1000 Tube of 50 TXB0104YZTR TXB0104GXUR TXB0104ZXUR TXB0104RGYR TXB0104RGYRG4 TXB0104D TXB0104DG4 TXB0104DR TXB0104DRG4 TXB0104PWR TXB0104PWRG4

TOP-SIDE MARKING (3) 2K7 YE04 YE04 YE04

NanoFree? — WCSP (DSBGA) 0.23-mm Large Bump – YZT (Pb-free) 0.625-mm max height UFBGA – GXU UFBGA – ZXU (Pb-Free) QFN – RGY –40°C to 85°C

SOIC – D Reel of 2500 TSSOP – PW (1) (2) (3) Reel of 2000

TXB0104

YE04

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. YZT: The actual top-side marking has three preceding characters to denote year, month, amd sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ? = Pb-free).

2

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Copyright ? 2006–2008, Texas Instruments Incorporated

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TXB0104

www.ti.com.............................................................................................................................................................. SCES650D – APRIL 2006 – REVISED MAY 2008

PIN DESCRIPTION
PIN NO. D, PW, OR RGY 1 2 3 4 5 6 7 8 9 10 11 12 13 14 C4 C3 C2 C1 B1 D1 C1 B1 A1 A2 B4 B3 D2 C2 B2 A1 A2 A3 A4 BALL NO. GXU/ZXU YZT B2 A3 B3 C3 D3 NAME VCCA A1 A2 A3 A4 NC GND OE NC B4 B3 B2 B1 VCCB FUNCTION A-port supply voltage 1.2 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB. Input/output 1. Referenced to VCCA. Input/output 2. Referenced to VCCA. Input/output 3. Referenced to VCCA. Input/output 4. Referenced to VCCA. No connection. Not internally connected. Ground 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. No connection. Not internally connected. Input/output 4. Referenced to VCCB. Input/output 3. Referenced to VCCB. Input/output 2. Referenced to VCCB. Input/output 1. Referenced to VCCB. B-port supply voltage 1.65 V ≤ VCCB ≤ 5.5 V.

ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN VCCA VCCB VI VO VO IIK IOK IO Tstg (1) (2) Supply voltage range Input voltage range Voltage range applied to any output in the high-impedance or power-off state Voltage range applied to any output in the high or low state (2) Input clamp current Output clamp current Continuous output current Continuous current through VCCA, VCCB, or GND Storage temperature range –65 A port B port A port B port A port B port VI < 0 VO < 0 –0.5 –0.5 –0.5 –0.5 –0.5 -0.5 –0.5 –0.5 MAX 4.6 6.5 4.6 6.5 4.6 6.5 VCCA + 0.5 VCCB + 0.5 –50 –50 ±50 ±100 150 UNIT V V V V mA mA mA mA °C

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The value of VCCA and VCCB are provided in the recommended operating conditions table.

Copyright ? 2006–2008, Texas Instruments Incorporated

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元器件交易网www.cecb2b.com TXB0104
SCES650D – APRIL 2006 – REVISED MAY 2008.............................................................................................................................................................. www.ti.com

THERMAL IMPEDANCE RATINGS
UNIT D package θJA Package thermal impedance
(1)

86 129 113 47 90 °C/W

GXU/ZXU package (1) PW package (1) RGY package YZT package (1) (2) The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5.
(2)

RECOMMENDED OPERATING CONDITIONS (1) (2)
VCCA VCCA VCCB VIH VIL Supply voltage High-level input voltage Low-level input voltage Data inputs OE Data inputs OE 1.2 V to 3.6 V 1.2 V to 3.6 V 1.2 V to 5.5 V 1.2 V to 3.6 V 1.2 V to 3.6 V 1.2 V to 3.6 V 1.2 V to 3.6 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 3.6 V 4.5 V to 5.5 V –40 VCCB MIN 1.2 1.65 VCCI × 0.65 (3) VCCA × 0.65 0 0 0 0 MAX 3.6 5.5 VCCI 5.5 VCCI × 0.35 (3) VCCA × 0.35 3.6 5.5 40 40 30 85 °C ns/V V UNIT V V V

VO

Voltage range applied to any A-port output in the high-impedance B-port or power-off state A-port inputs Input transition rise or fall rate Operating free-air temperature

Δt/Δv TA (1) (2) (3)

B-port inputs

The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND. VCCA must be less than or equal to VCCB and must not exceed 3.6 V. VCCI is the supply voltage associated with the input port.

4

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Copyright ? 2006–2008, Texas Instruments Incorporated

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TXB0104

www.ti.com.............................................................................................................................................................. SCES650D – APRIL 2006 – REVISED MAY 2008

ELECTRICAL CHARACTERISTICS (1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER VOHA VOLA VOHB VOLB II Ioff IOZ OE A port B port A or B port TEST CONDITIONS IOH = –20 ?A IOL = 20 ?A IOH = –20 ?A IOL = 20 ?A VI = VCCI or GND VI or VO = 0 to 3.6 V VI or VO = 0 to 5.5 V OE = GND 1.2 V to 3.6 V 0V 0 V to 3.6 V 1.2 V to 3.6 V 1.2 V ICCA VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 3.6 V 0V 1.2 V ICCB VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 3.6 V 0V ICCA + ICCB VI = VCCI or GND, IO = 0 VI = VCCI or GND, IO = 0, OE = GND VI = VCCI or GND, IO = 0, OE = GND OE A port B port 1.2 V 1.4 V to 3.6 V 1.2 V 1.4 V to 3.6 V 1.2 V 1.4 V to 3.6 V 1.2 V to 3.6 V 1.2 V to 3.6 V VCCA 1.2 V 1.4 V to 3.6 V 1.2 V 1.4 V to 3.6 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 0 V to 5.5 V 0V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 0V 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 0V 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 3 5 11 3.3 5 4 6 14 0.05 5 3.5 10 3.4 5 –2 2 ?A ?A ?A 0.06 5 2 –2 ?A ±1 ±1 ±1 ±1 VCCB – 0.4 0.4 ±2 ±2 ±2 ±2 0.9 0.4 VCCB TA = 25°C MIN TYP MAX 1.1 VCCA – 0.4 –40°C to 85°C MIN MAX UNIT V V V V ?A ?A ?A

ICCZA

ICCZB Ci Cio (1) (2)

?A pF pF

VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port.

Copyright ? 2006–2008, Texas Instruments Incorporated

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元器件交易网www.cecb2b.com TXB0104
SCES650D – APRIL 2006 – REVISED MAY 2008.............................................................................................................................................................. www.ti.com

TIMING REQUIREMENTS
TA = 25°C, VCCA = 1.2 V
VCCB = 1.8 V TYP Data rate tw Pulse duration Data inputs 20 50 VCCB = 2.5 V TYP 20 50 VCCB = 3.3 V TYP 20 50 VCCB = 5 V TYP 20 50 UNIT Mbps ns

TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V ± 0.15 V MIN Data rate tw Pulse duration Data inputs 25 MAX 40 25 VCCB = 2.5 V ± 0.2 V MIN MAX 40 25 VCCB = 3.3 V ± 0.3 V MIN MAX 40 25 VCCB = 5 V ± 0.5 V MIN MAX 40 Mbps ns UNIT

TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V ± 0.15 V MIN Data rate tw Pulse duration Data inputs 17 MAX 60 17 VCCB = 2.5 V ± 0.2 V MIN MAX 60 17 VCCB = 3.3 V ± 0.3 V MIN MAX 60 17 VCCB = 5 V ± 0.5 V MIN MAX 60 Mbps ns UNIT

TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V ± 0.2 V MIN Data rate tw Pulse duration Data inputs 10 MAX 100 10 VCCB = 3.3 V ± 0.3 V MIN MAX 100 10 VCCB = 5 V ± 0.5 V MIN MAX 100 Mbps ns UNIT

TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V ± 0.3 V MIN Data rate tw Pulse duration Data inputs 10 MAX 100 10 VCCB = 5 V ± 0.5 V MIN MAX 100 Mbps ns UNIT

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TXB0104

www.ti.com.............................................................................................................................................................. SCES650D – APRIL 2006 – REVISED MAY 2008

SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
PARAMETER tpd ten tdis trA, tfA trB, tfB tSK(O) Max data rate FROM (INPUT) A B OE OE TO (OUTPUT) B A A B A B VCCB = 1.8 V TYP 6.9 7.4 1 1 18 20 4.2 2.1 0.4 20 VCCB = 2.5 V TYP 5.7 6.4 1 1 15 17 4.2 1.5 0.5 20 VCCB = 3.3 V TYP 5.3 6 1 1 14 16 4.2 1.2 0.5 20 VCCB = 5 V TYP 5.5 5.8 1 1 14 16 4.2 1.1 1.4 20 UNIT ns ?s ns ns ns ns Mbps

A-port rise and fall times B-port rise and fall times Channel-to-channel skew

SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
PARAMETER FROM (INPUT) A B OE OE TO (OUTPUT) B A A B A B 5.9 5.4 1.4 0.9 40 VCCB = 1.8 V ± 0.15 V MIN 1.4 0.9 MAX 12.9 14.2 1 1 31 30.3 5.1 4.5 0.5 40 5.7 4.9 1.4 0.6 VCCB = 2.5 V ± 0.2 V MIN 1.2 0.7 MAX 10.1 12 1 1 25.9 22.8 5.1 3.2 0.5 40 5.6 4.8 1.4 0.5 VCCB = 3.3 V ± 0.3 V MIN 1.1 0.4 MAX 10 11.7 1 1 23 20 5.1 2.8 0.5 40 5.7 4.9 1.4 0.4 VCCB = 5 V ± 0.5 V MIN 0.8 0.3 MAX 9.9 13.7 1 1 22.4 19.5 5.1 2.7 0.5 ns ?s ns ns ns ns Mbps UNIT

tpd ten tdis trA, tfA trB, tfB tSK(O) Max data rate

A-port rise and fall times B-port rise and fall times Channel-to-channel skew

SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER FROM (INPUT) A B OE OE TO (OUTPUT) B A A B A B 5.9 5.4 1 0.9 60 VCCB = 1.8 V ± 0.15 V MIN 1.6 1.5 MAX 11 12 1 1 31 30.3 4.2 3.8 0.5 60 5.1 4.4 1.1 0.6 VCCB = 2.5 V ± 0.2 V MIN 1.4 1.3 MAX 7.7 8.4 1 1 21.3 20.8 4.1 3.2 0.5 60 5 4.2 1.1 0.5 VCCB = 3.3 V ± 0.3 V MIN 1.3 1 MAX 6.8 7.6 1 1 19.3 17.9 4.1 2.8 0.5 60 5 4.3 1.1 0.4 VCCB = 5 V ± 0.5 V MIN 1.2 0.9 MAX 6.5 7.1 1 1 17.4 16.3 4.1 2.7 0.5 ns ?s ns ns ns ns Mbps UNIT

tpd ten tdis trA, tfA trB, tfB tSK(O) Max data rate

A-port rise and fall times B-port rise and fall times Channel-to-channel skew

Copyright ? 2006–2008, Texas Instruments Incorporated

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元器件交易网www.cecb2b.com TXB0104
SCES650D – APRIL 2006 – REVISED MAY 2008.............................................................................................................................................................. www.ti.com

SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER FROM (INPUT) A B OE OE TO (OUTPUT) B A A B A B 5.1 4.4 0.8 0.7 100 VCCB = 2.5 V ± 0.2 V MIN 1.1 1.2 MAX 6.3 6.6 1 1 21.3 20.8 3 2.6 0.5 100 4.6 3.8 0.8 0.5 VCCB = 3.3 V ± 0.3 V MIN 1 1.1 MAX 5.2 5.1 1 1 15.2 16 3 2.8 0.5 100 4.6 3.9 0.8 0.4 VCCB = 5 V ± 0.5 V MIN 0.9 0.9 MAX 4.7 4.4 1 1 13.2 13.9 3 2.7 0.5 ns ?s ns ns ns ns Mbps UNIT

tpd ten tdis trA, tfA trB, tfB tSK(O) Max data rate

A-port rise and fall times B-port rise and fall times Channel-to-channel skew

SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER FROM (INPUT) A B OE OE A-port rise and fall times B-port rise and fall times Channel-to-channel skew 100 TO (OUTPUT) B A A B A B 4.6 3.8 0.7 0.5 VCCB = 3.3 V ± 0.3 V MIN 0.9 1 MAX 4.7 4.9 1 1 15.2 16 2.5 2.1 0.5 100 4.3 3.4 0.7 0.4 VCCB = 5 V ± 0.5 V MIN 0.8 0.9 MAX 4 3.8 1 1 12.1 13.2 2.5 2.7 0.5 ns ?s ns ns ns ns Mbps UNIT

tpd ten tdis trA, tfA trB, tfB tSK(O) Max data rate

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TXB0104

www.ti.com.............................................................................................................................................................. SCES650D – APRIL 2006 – REVISED MAY 2008

OPERATING CHARACTERISTICS
TA = 25°C
VCCA 1.2 V PARAMETER TEST CONDITIONS 5V TYP CpdA CpdB CpdA CpdB A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) 7.8 12 38.1 25.4 0.01 0.01 0.01 0.01 1.8 V TYP 10 11 28 19 0.01 0.01 0.01 0.01 1.8 V TYP 9 11 28 18 0.01 0.01 0.01 0.01 1.8 V TYP 8 11 28 18 0.01 0.01 0.01 0.01 2.5 V TYP 8 11 29 19 0.01 0.01 0.01 0.01 5V TYP 8 11 29 21 0.01 0.01 0.01 0.01 1.2 V 1.5 V 1.8 V VCCB 3.3 V to 5V TYP 9 11 29 22 0.01 0.01 0.03 0.04 pF pF UNIT 2.5 V 2.5 V 3.3 V

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元器件交易网www.cecb2b.com TXB0104
SCES650D – APRIL 2006 – REVISED MAY 2008.............................................................................................................................................................. www.ti.com

PRINCIPLES OF OPERATION Applications
The TXB0104 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another.

Architecture
The TXB0104 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0104 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 70 ? at VCCO = 1.2 V to 1.8 V, 50 ? at VCCO = 1.8 V to 3.3 V, and 40 ? at VCCO = 3.3 V to 5 V.
VCCA VCCB

One Shot

T1

4k One Shot A One Shot

T2

B

T3

4k One Shot

T4

Figure 1. Architecture of TXB0104 I/O Cell

Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0104 are shown in Figure 2. For proper operation, the device driving the data I/Os of the TXB0104 must have drive strength of at least ±2 mA.

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TXB0104

www.ti.com.............................................................................................................................................................. SCES650D – APRIL 2006 – REVISED MAY 2008

IIN

VT/4 kW

VIN

–(VD – VT)/4 kW

A. VT is the input threshold voltage of the TXB0104 (typically VCCI/2). B. VD is the supply voltage of the external driver.

Figure 2. Typical IIN vs VIN Curve

Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. The TXB0104 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V).

Enable and Disable
The TXB0104 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs acutally get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high.

Pullup or Pulldown Resistors on I/O Lines
The TXB0104 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0104 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50 k? to ensure that they do not contend with the output drivers of the TXB0104. For the same reason, the TXB0104 should not be used in applications such as I2C or 1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators.

Copyright ? 2006–2008, Texas Instruments Incorporated

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元器件交易网www.cecb2b.com TXB0104
SCES650D – APRIL 2006 – REVISED MAY 2008.............................................................................................................................................................. www.ti.com

PARAMETER MEASUREMENT INFORMATION
2 × VCCO From Output Under Test 15 pF 1 MW From Output Under Test 15 pF 50 kW S1 Open

50 kW

LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT

LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT

TEST tPZL/tPLZ tPHZ/tPZH

S1 2 × VCCO Open

Input

VCCI VCCI/2 tPLH VCCI/2 0V tPHL tw
0.9 y VCCO 0.1 y VCCO

Output

VOH VCCO/2
tf

VCCO/2 tr

VCCI Input VCCI/2 VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION

VOL

VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. B. C. D. E. F. G.

CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 ?, dv/dt ≥ 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices.

Figure 3. Load Circuits and Voltage Waveforms

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Copyright ? 2006–2008, Texas Instruments Incorporated

元器件交易网www.cecb2b.com PACKAGE OPTION ADDENDUM
www.ti.com

18-Sep-2008

PACKAGING INFORMATION
Orderable Device TXB0104D TXB0104DG4 TXB0104DR TXB0104DRG4 TXB0104GXUR Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOIC SOIC SOIC SOIC BGA MI CROSTA R JUNI OR TSSOP TSSOP QFN QFN DSBGA BGA MI CROSTA R JUNI OR Package Drawing D D D D GXU Pins Package Eco Plan (2) Qty 14 14 14 14 12 50 50 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU SNPB MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-240C-UNLIM

2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 TBD

TXB0104PWR TXB0104PWRG4 TXB0104RGYR TXB0104RGYRG4 TXB0104YZTR TXB0104ZXUR

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

PW PW RGY RGY YZT ZXU

14 14 14 14 12 12

2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 1000 Green (RoHS & no Sb/Br) 1000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br)

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU SNAGCU SNAGCU

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

Addendum-Page 1

元器件交易网www.cecb2b.com PACKAGE OPTION ADDENDUM
www.ti.com

18-Sep-2008

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TXB0104 : ? Automotive: TXB0104-Q1 NOTE: Qualified Version Definitions: ? Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2

元器件交易网www.cecb2b.com PACKAGE MATERIALS INFORMATION
www.ti.com

17-Jul-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC BGA MI CROSTA R JUNI OR TSSOP QFN DSBGA BGA MI CROSTA R JUNI OR D GXU 14 12

SPQ

Reel Reel Diameter Width (mm) W1 (mm) 330.0 330.0 16.4 8.4

A0 (mm)

B0 (mm)

K0 (mm)

P1 (mm) 8.0 4.0

W Pin1 (mm) Quadrant 16.0 8.0 Q1 Q2

TXB0104DR TXB0104GXUR

2500 2500

6.5 2.3

9.0 2.8

2.1 1.0

TXB0104PWR TXB0104RGYR TXB0104YZTR TXB0104ZXUR

PW RGY YZT ZXU

14 14 12 12

2000 1000 3000 2500

330.0 180.0 180.0 330.0

12.4 12.4 8.4 8.4

7.0 3.85 1.5 2.3

5.6 3.85 2.03 2.8

1.6 1.35 0.7 1.0

8.0 8.0 4.0 4.0

12.0 12.0 8.0 8.0

Q1 Q1 Q2 Q2

Pack Materials-Page 1

元器件交易网www.cecb2b.com PACKAGE MATERIALS INFORMATION
www.ti.com

17-Jul-2008

*All dimensions are nominal

Device TXB0104DR TXB0104GXUR TXB0104PWR TXB0104RGYR TXB0104YZTR TXB0104ZXUR

Package Type SOIC BGA MICROSTAR JUNIOR TSSOP QFN DSBGA BGA MICROSTAR JUNIOR

Package Drawing D GXU PW RGY YZT ZXU

Pins 14 12 14 14 12 12

SPQ 2500 2500 2000 1000 3000 2500

Length (mm) 346.0 340.5 346.0 190.5 220.0 340.5

Width (mm) 346.0 338.1 346.0 212.7 220.0 338.1

Height (mm) 33.0 20.6 29.0 31.8 34.0 20.6

Pack Materials-Page 2

元器件交易网www.cecb2b.com

MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)
14 PINS SHOWN

PLASTIC SMALL-OUTLINE PACKAGE

0,65 14 8

0,30 0,19

0,10 M

0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0°– 8° 0,75 0,50

Seating Plane 1,20 MAX 0,15 0,05 0,10

PINS ** DIM A MAX

8

14

16

20

24

28

3,10

5,10

5,10

6,60

7,90

9,80

A MIN

2,90

4,90

4,90

6,40

7,70

9,60

4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153

POST OFFICE BOX 655303

? DALLAS, TEXAS 75265

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IMPORTANT NOTICE
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